US 7,247,940 B2 · Optoelectronic device with patterned-metallized package body, method for producing such a device and method for the patterned metallization of a plastic-containing body

Abstract

An optoelectronic device, comprising a package body (57) and at least one semiconductor chip (50) arranged on the package body (57). The surface of the package body (57) has a metallized subregion (15) and a non-metallized subregion (20). The package body (57) includes at least two different plastics (53, 54), one of the plastics being non-metallizable (54) and this plastic determining the non-metallized subregion (20). A method for producing such components and a method for the patterned metallization of a plastic-containing body are also provided.

Claims36

Dependent claims

An optoelectronic device, comprising:

a package body that comprises at least two different plastics, one of the plastics being non-metallizable;
and
at least one semiconductor chip fixed on the package body, wherein a surface of the package body has a metallized subregion and a non-metallized subregion, the non-metallized subregion is formed via the non-metallizable plastic, the metallized subregion is formed via a metallizable plastic, with the metallized subregion being divided into at least two regions that are electrically separated from each other by an insulating web and the insulating web being formed by the non-metallizable plastic.

Dependencies are inferred from the claim text.

Facts

Application

10/792,538Filed 1 Mar 2004

Priority

DE 103 08 91728 Feb 2003

Published

US 2004/0232435 A125 Nov 2004

Granted

24 Jul 2007

Term ends

Not estimatedThe source records don’t support an estimate.

Classification6 codes

H10H 20/857
Packages: interconnections, e.g. lead-frames, bond wires or solder balls
H10H 20/8506
Packages: containers
H10W 74/10
Encapsulations, e.g. protective coatings: characterised by their shape or disposition
H10W 90/756
Of bond wires: between a chip and a stacked lead frame, conducting package substrate or heat sink

Optoelectronic device with patterned-metallized package body, method for producing such a device and method for the patterned metallization of a plastic-containing body

Life of this patent

Optoelectronic device with patterned-metallized package body, method for producing such a device and method for the patterned metallization of a plastic-containing body

Life of this patent

Abstract

Claims36