Mounting pad structure for wire-bonding type lead frame packages

A single-ended mode wire-bonding type lead-frame package having a die pad, a chip attached to the die pad, a plurality of signal leads, a plurality of non-signal leads, a plurality of bonding wires connecting the chip to the leads respectively, and an insulation material encapsulating the leads, the chip, and the bonding wires, comprising:

• a substrate with a plurality of pads disposed on a top surface of the substrate, the pads comprising:
• a plurality of signal pads which are underneath the signal leads respectively and a plurality of non-signal pads which are underneath the non-signal leads respectively, wherein at least one of the signal pads has a structure which extends toward at least one of the adjacent non-signal pads and overlaps with at least a part of the adjacent non-signal lead but without touching the adjacent non-signal pad and the adjacent non-signal lead, and the adjacent non-signal pad connects to a non-signal plane in the substrate through a via.

A differential mode wire-bonding type lead-frame package having a die pad, a chip attached to the die pad, a plurality of signal leads, a plurality of non-signal leads, a plurality of bonding wires connecting the chip to the leads respectively, and an insulation material encapsulating the leads, the chip, and the bonding wires, comprising:

• a substrate with a plurality of pads disposed on a top surface of the substrate, the pads comprising:
• two signal pads which adjacent to each other are underneath the signal leads, and two non-signal pads which are disposed on the outer sides of the two signal pads respectively and are underneath the non-signal leads, wherein each of the two signal pads extends toward the adjacent non-signal pad respectively and overlaps with at least a part of the adjacent non-signal lead, but without touching the adjacent non-signal pad and the adjacent non-signal lead, and the two non-signal pads connect to a non-signal plane in the substrate through vias respectively.