Tape circuit substrate having wavy beam leads and semiconductor chip package using the same
AssigneeSamsung Electronics Co., Ltd.
InventorsDae-Woo Son, Jin-Hyuk Lee, Kwan-Jai Lee
Life of this patent
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Abstract
A semiconductor chip package includes an IC chip and a tape circuit substrate. The tape circuit substrate has a base film and a plurality of beam leads formed on the base film. One end portion of each beam lead extends from the base film, and the extended portion has a widthwise wavy portion. The widthwise wavy portion may be, for example, semicircular shaped, S-shaped or zig-zag shaped. The IC chip has chip pads formed on a top surface thereof.
Claims39
A tape circuit substrate comprising:
- a base film;
- and
- a plurality of beam leads adjacent to the base film having a length and a width, each beam lead including a widthwise wavy portion, wherein the base film has a substantially uniform thickness that follows the contours of the beam leads and does not have an opening extending therethrough.
A semiconductor chip package comprising:
- an integrated circuit chip including a plurality of chip pads formed on a top surface thereof;
- and
- a tape circuit substrate including:
- a base film having a top surface;
- a plurality of beam leads having a length and a width formed on the top surface of the base film, wherein one end portion of the beam lead extends toward the chip pad from the base film and is bonded to the chip pad, and wherein the extended portion of the beam lead has a widthwise wavy portion;
- and
- a protective layer covering the beam leads and the top surface of the base film.
A semiconductor chip package comprising:
- an integrated circuit chip including a plurality of chip pads formed on a top surface thereof;
- and
- a tape circuit substrate including a base film, a plurality of beam leads formed on a first surface of the base film, and a plurality of solder balls formed on a second surface of the base film,
- wherein a first end portion of each beam lead is electrically connected to the solder ball, wherein a second end portion of each beam lead is protruded toward the chip pad from the base film and bonded to the chip pad, and wherein the protruded portion of each beam lead has a wavy portion.
A semiconductor chip package comprising:
- an integrated circuit chip including a plurality of chip pads formed on a top surface thereof;
- and
- a tape circuit substrate including:
- a base film having an opening formed therethrough, the opening defining an inside edge;
- and
- a plurality of beam leads formed on the base film, wherein each beam lead includes a neck portion extending substantially laterally from the edge of the base film into the opening and a widthwise wavy portion extending from the neck portion through the opening toward at least one of the chip pads formed on the top surface of the integrated circuit chip.
A tape circuit substrate comprising:
- a flexible base film;
- and
- a plurality of beam leads adjacent the base film, each beam lead including a wavy portion, wherein the base film has a substantially uniform thickness that follows the contours of the beam leads, and wherein the base film does not have an opening extending therethrough.
A tape circuit substrate comprising:
- a base film;
- and
- a plurality of beam leads adjacent to the base film, each beam lead including a neck portion extending substantially laterally from the base film and a widthwise wavy portion extending from the neck portion, wherein the widthwise wavy portion of the beam lead includes a semicircular widthwise wavy portion or an S-shaped widthwise wavy portion.
A tape circuit substrate comprising:
- a base film;
- and
- a plurality of beam leads adjacent to the base film having a length and a width, each beam lead including a widthwise wavy portion, wherein the base film has a substantially uniform thickness that follows substantially the entire contours of the beam.
Dependencies are inferred from the claim text.