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US 7,247,929 B2Granted
Molded semiconductor device with heat conducting members
AssigneeDenso Corporation
InventorsShoji Miura, Yoshimi Nakase
Life of this patent
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Abstract
A power element package includes a semiconductor chip, radiating members, a mold resin member, a lead terminal for control signals, and lead terminals for large electric current. On a heat accepting surface of the radiating member, an insulating layer and a conductive layer are disposed. The lead terminal for control signals is electrically connected with a gate of the semiconductor chip through the conductive layer. An emitter of the semiconductor chip is electrically connected through a solder connection member with a non-insulating portion of the heat accepting surface.
Claims14
A semiconductor device comprising:
- an element of a semiconductor switching element that includes first and second surfaces, wherein a first electrode is exposed on the first surface, a second electrode is exposed on the second surface, and a control electrode is exposed on a control-electrode-exposing surface that is one of the first and second surfaces;
- two radiating members between which the element is disposed, wherein the two radiating members are electrically connected with the first and second electrodes, respectively, wherein each of the two radiating members has an inward and outward surfaces, wherein the inward surface is closer to the element than the outward surface;
- a mold resin member filling a space between the two radiating members;
- an insulating layer formed on an insulated portion of at least one of the inward surfaces of the two radiating members;
- and
- a conductive layer formed on the insulating layer and electrically connected with the control electrode and an input portion protruding from the mold resin member, wherein
- one of the first and second electrodes is electrically connected with a non-insulating portion of the inward surface on which the insulated portion is located, wherein no insulating layer is formed on the non-insulating portion,
- the input portion includes a lead terminal for control signals, and
- a first end of the lead terminal is protruding from the mold resin member while a second end of the lead terminal is, with the conductive layer, overlapped and electrically connected using a conductive connection member.
6 more elements
A semiconductor device comprising:
- an element of a semiconductor switching element that includes first and second surfaces, wherein a first electrode is exposed on the first surface, a second electrode is exposed on the second surface, and a control electrode is exposed on a control-electrode-exposing surface that is one of the first and second surfaces;
- two radiating members between which the element is disposed, wherein the two radiating members are electrically connected with the first and second electrodes, respectively, wherein each of the two radiating members has an inward and outward surfaces, wherein the inward surface is closer to the element than the outward surface;
- a mold resin member filling a space between the two radiating members;
- an insulating layer formed on an insulated portion of at least one of the inward surfaces of the two radiating members;
- and
- a conductive layer formed on the insulating layer and electrically connected with the control electrode and an input portion protruding from the mold resin member, wherein
- one of the first and second electrodes is electrically connected with a non-insulating portion of the inward surface on which the insulated portion is located, wherein no insulating layer is formed on the non-insulating portion,
- one of the first and second electrodes that is exposed on the control-electrode-exposing surface is overlapped with the non-insulating portion of the inward surface,
- the non-insulating portion is formed as an opening of the insulating layer such that in an overhead view an area of the one of the first and second electrodes that is exposed on the control-electrode-exposing surface lies within the opening, and
- the one of the first and second electrodes that is exposed on the control-electrode-exposing surface is electrically connected with the non-insulating portion of the inward surface.
7 more elements
A semiconductor device comprising:
- an element of a semiconductor switching element that includes first and second surfaces, wherein a first electrode is exposed on the first surface, a second electrode is exposed on the second surface, and a control electrode is exposed on a control-electrode-exposing surface that is one of the first and second surfaces;
- two radiating members between which the element is disposed, wherein the two radiating members are electrically connected with the first and second electrodes, respectively, wherein each of the two radiating members has an inward and outward surfaces, wherein the inward surface is closer to the element than the outward surface;
- a mold resin member filling a space between the two radiating members;
- an insulating layer formed on an insulated portion of at least one of the inward surfaces of the two radiating members;
- and
- a conductive layer formed on the insulating layer and electrically connected with the control electrode and an input portion protruding from the mold resin member, wherein one of the first and second electrodes is electrically connected with a non-insulating portion of the inward surface on which the insulated portion is located, wherein no insulating layer is formed on the non-insulating portion;
- a first lead terminal whose first end is electrically connected with a first radiating member of the two radiating members and whose second end is outwardly protruding from the mold resin member;
- a second lead terminal whose first end is electrically connected with a second radiating member of the two radiating members and whose second end is outwardly protruding from the mold resin member;
- and
- a third lead terminal that is included in the input portion, wherein a first end of the third lead terminal is outwardly protruding from the mold resin member while a second end of the third lead terminal is, with the conductive layer, overlapped and electrically connected using a conductive connection member.
7 more elements
Dependencies are inferred from the claim text.