Semiconductor device with electrical connection balls between an integrated circuit chip and a support plate, and process for fabricating it

A process for fabricating a semiconductor device comprising a support plate, an integrated circuit chip placed at a certain location on the support plate and placed at a certain distance from this support plate, a plurality of electrical connection balls connecting electrical connection regions of the support plate and corresponding electrical connection pads on the chip, and a fill material at least partly filling the space separating the chip from the plate, the method comprising:

• providing the surface of the support plate having the electrical connection regions with an interlayer made of an insulating material;
• providing, in this interlayer, apertures directly above the electrical connection regions and complementary flow channels including at least one peripheral flow channel that passes directly above the connection regions and connects to the apertures, and radial flow channels that extend outwardly from a central part of the certain location and are connected to the at least one peripheral flow channel;
• depositing at least one drop of the fill material in liquid state at the central part of the certain location;
• bringing the chip into place above the support plate at the certain location and lowering the chip in such a way that the drop flows from the central part of the certain location in the complementary flow channels and over the support plate and at least partly fills the empty space between the chip and the surface of the support plate;
• and
• soldering the balls and curing the fill material.

An electronic device comprising:

• a plurality of semiconductor devices, at least one of the plurality of the semiconductor devices comprising:
• an electrical connection support plate;
• an integrated circuit chip placed at a certain location on the support plate and placed at a certain distance from this support plate;
• a plurality of electrical connection balls connecting electrical connection regions of the support plate and corresponding electrical connection pads on the chip;
• an interlayer made of an insulating material disposed on a surface of the support plate and between the chip and the support plate, wherein apertures are provided in the interlayer directly above the electrical connection regions, and wherein complementary flow channels that include the apertures are provided in the interlayer to permit, when the chip is placed on the certain location on the support plate, liquid fill material in channels at a central part of the certain location to flow substantially parallel to the surface of the chip through the channels and over the support plate to fill empty space between the chip and the surface of the support plate, wherein the complementary flow channels in the interlayer include
• at least one peripheral flow channel that passes directly above a plurality of the electrical connection regions and connects to a plurality of apertures respectively directly above the plurality of the electrical connection regions, and
• radial flow channels that extend outwardly from a central part of the certain location and are connected to the at least one peripheral flow channel;
• and
• a fill material at least partly filling the space separating the chip from the support plate.