Semiconductor device and manufacturing method thereof

A semiconductor device comprising:

• a first impurity diffusion region and a second impurity diffusion region having a first conduction type but different impurity concentrations and respectively formed on one main surface of a semiconductor substrate at a predetermined distance from each other;
• a channel region formed in a third impurity diffusion region of the semiconductor substrate which has a second conduction type opposite to the first conduction type and is formed between the first impurity diffusion region and the second impurity diffusion region;
• a fourth impurity diffusion region having the second conduction type and being formed between the first impurity diffusion region and the substrate as well as between the first and third impurity diffusion regions;
• and
• an MISFET formed by stacking a gate electrode by way of a gate dielectric film above the channel region and portions of the first and second impurity diffusion regions;
• wherein an impurity concentration of the third impurity diffusion region is lower than an impurity concentration of the fourth impurity diffusion region, and
• an anti-oxidation film deposited by a deposition method on a side wall of the gate electrode is formed to prevent polysilicon of the gate electrode from being oxidized during a light oxidation treatment.

A semiconductor device having a DRAM memory cell including a MISFET, an information storage capacitor portion and an information transfer data line formed respectively over a semiconductor substrate,

• wherein
• the MISFET has a first impurity diffusion region for connecting the MISFET with the information storage capacitor portion and a second impurity diffusion region for connecting the information transfer data line with the MISFET,
• the second impurity diffusion region is formed with a first conductive type as the first impurity diffusion region and an impurity concentration higher than that of the first impurity diffusion region,
• a channel region formed in a third impurity diffusion region of the semiconductor substrate which has a second conduction type opposite to the first conduction type and is formed between the first impurity diffusion region and the second impurity diffusion region;
• a fourth impurity diffusion region having the second conduction type, having an impurity concentration higher than that of the third impurity diffusion region, and being formed between the first impurity diffusion region and the substrate as well as between the first and third impurity diffusion regions;
• and
• a film deposited by a CVD method on a side wall of the gate electrode and formed to prevent polysilicon of the gate electrode from being oxidized during a light oxidation treatment,
• wherein the gate electrode is formed by stacking a gate dielectric film over the channel region and portions of the first impurity diffusion region and the second impurity diffusion region.