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US 7,247,800 B2Granted
Module circuit board for semiconductor device having barriers to isolate I/O terminals from solder
AssigneeOki Electric Industry Co., Ltd.
InventorNorio Takahashi
Life of this patent
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Abstract
A module circuit board for a semiconductor device by a solder reflow process includes a plurality of pads on which the semiconductor device to be mounted, a plurality of terminals formed on a side edge of the board, a resist film covering an area between said pads and said terminal on the board, and a barrier formed between said pads and said terminals.
Claims11
A circuit board for a semiconductor device, comprising:
- a plurality of pads for the semiconductor device on which the semiconductor device is to be mounted, said pads being formed on the circuit board, and said pads being disposed only in a first line, which is in parallel to one of the sides of the circuit board;
- a plurality of terminals for an external device formed on the side edge of the circuit board, said terminals being disposed only in a second line, which is in parallel to said first line of said pads,
- whereby no pads and terminals are formed in line along other sides of the circuit board, and the pads in the first line and the terminals in the second line are always in parallel;
- a resist film covering an area on the circuit board between said pads and said terminals;
- and
- a barrier formed between said first line of said pads and said second line of said terminals, said barrier including a plurality of line-shaped trench extending along said terminals, and said trenches being formed in said resist film,
- wherein the entire surface of the circuit board in each trench is exposed.
4 more elements
Dependencies are inferred from the claim text.