Low voiding no flow fluxing underfill for electronic devices
AssigneeFry's Metals, Inc.
InventorsJames M. Hurley, Mark Wilson, Xiaoyun Ye
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Abstract
A no flow fluxing underfill having a hardener component comprising a phenolic component and an anhydride component in a molar ratio of phenolic component to anhydride component of between about 0.1:1 and about 2:1; or between about 0.8:1 and about 1.2:1. An underfill preparation method involving blending an epoxy component and a phenolic component, heating the blend, and cooling the blend, prior to incorporation of an anhydride component.
Claims48
A method of preparing a dispensable underfill composition of the type comprising an epoxy component, an anhydride component, and a phenolic component for use in electronics manufacture, the method comprising the following steps in order:
- (1) blending the epoxy component and at least about 80 wt % of the phenolic component to yield an epoxy/phenolic blend;
- (2) heating the epoxy/phenolic blend to a temperature greater than a softening temperature of the phenolic component and below a temperature at which the epoxy component and phenolic component polymerize;
- (3) cooling the epoxy/phenolic blend;
- and
- (4) blending the anhydride component into the epoxy/phenolic blend to yield the dispensable underfill composition.
Dependencies are inferred from the claim text.