Photosensitive resin composition
AssigneeCiba Specialty Chemicals Corporation
InventorsHisatoshi Kura, Hidetaka Oka, Masaki Ohwa
Life of this patent
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Abstract
A photosensitive composition comprising, (A) an oligomer or polymer containing at least one carboxylic acid group in the molecule and having a molecular weight of 200′000 or less; (B) at least one photoinitiator compound of formula I wherein R1 is linear or branched C1–C12alkyl; R2 is linear or branched C1–C4alkyl; R3 and R4 independently of one another are linear or branched C1–C8alkyl; and (C) a monomeric, oligomeric or polymeric compound having at least one olefinic double bond, is especially suitable for preparting photoresists, in particular color filters.
Claims16
A photosensitive composition comprising,
- (A) a polymer containing at least one carboxylic acid group in the molecule and having a molecular weight of 200′000 or less which polymer is an addition product of a carboxyl group-containing resin and an unsaturated compound having an α,β-unsaturated double bond and an epoxy group,
- wherein the carboxyl group-containing resin is selected from the group consisting of copolymers comprising as monomers one or more ethylenically unsaturated carboxylic acid compounds and one or more ethylenically unsaturated compounds selected from the group consisting of esters of methacrylic, acrylic, maleic and fumaric acid;
- (B) at least one photoinitiator compound of formula I
- wherein
- R1 is linear or branched C1–C12alkyl;
- R2 is linear or branched C1–C4alkyl;
- R3 and R4 independently of one another are linear or branched C1–C8alkyl;
- and
- (C) an ester of a polyol, wherein the polyol is partially or fully esterified with an ethylenically unsaturated carboxylic acid.
Dependencies are inferred from the claim text.