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US 7,247,564 B2Granted
Electronic device
AssigneeHewlett-Packard Development Company, L.P.
InventorChinmay S. Betrabet
Life of this patent
Estimating the term…
Abstract
One embodiment of a method of making an electronic device includes forming on a substrate surface a first layer having a peak-valley-peak profile, and forming a second layer on the first layer by use of a target positioned along a line-of-sight that excludes a floor of the valley such that the second layer is not formed on the floor of said peak-valley-peak profile.
Claims25
A method of making an electronic device, comprising:
- forming on a substrate surface a conductive layer having a peak-valley-peak profile;
- and
- forming an ohmic layer on said conductive layer by use of a target positioned along a line-of-sight that excludes a floor of said valley such that said ohmic layer is not formed on said floor of said peak-valley-peak profile.
An electronic device manufactured by a process comprising:
- forming on a substrate surface a metal base layer having multiple peaks;
- and
- forming an ohmic contact layer on selected portions of said metal base layer by use of a target positioned along an axis non-perpendicular to said substrate surface such that said ohmic contact layer does not extend onto a floor region positioned between said multiple peaks.
A method of manufacturing an electronic device, comprising:
- step for depositing a conductive layer having a peak-valley-peak profile;
- and
- in an absence of masking a valley floor of said peak-valley-peak profile, step for depositing an ohmic layer on said conductive layer excluding a valley floor of said peak-valley-peak profile.
Dependencies are inferred from the claim text.