Method and system for electroprocessing conductive layers
AssigneeNovellus Systems, Inc.
InventorsBulent M Basol, Homayoun Talieh
Life of this patent
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Abstract
The invention provides a process for forming a planar copper structure on a wafer surface in a first module and a second module of a system. During the process, a copper layer is formed on the wafer surface by utilizing an electrochemical deposition process in the first module. After the deposition, the wafer is moved to the second module of the system and an electrochemical mechanical polishing process is applied to planarize the copper layer to a predetermined thickness. The first and second modules can be positioned in a cluster tool. The wafer is subsequently processed by selective copper CMP and selective barrier layer CMP, which are conducted in another cluster tool.
Claims22
A method of fabricating a planar conductive structure over a plurality of cavities with a depth formed in a surface of a substrate, wherein the surface and the cavities are coated with a conductive film, the method comprising the steps of:
- performing in a first module of a tool an electrochemical deposition process until a conductive material is filled into the plurality of cavities, the conductive material forming a layer over the surface of the substrate;
- moving the substrate to a second module of the tool after performing the electrochemical deposition process;
- applying an electrochemical mechanical polishing process in the second module to planarize the layer of the conductive material to form a planar conductive structure with a non-zero predetermined thickness over the surface of the substrate;
- and
- removing the substrate having the planar conductive structure with the non-zero predetermined thickness from the tool after applying the electrochemical mechanical polishing process.
Dependencies are inferred from the claim text.