Substrate for electronic device, method for manufacturing substrate for electronic device, and electronic device
AssigneeSeiko Epson Corporation
InventorsTakamitsu Higuchi, Setsuya Iwashita, Hiromu Miyazawa
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AssigneeSeiko Epson Corporation
InventorsTakamitsu Higuchi, Setsuya Iwashita, Hiromu Miyazawa
Estimating the term…
The invention provides a substrate for an electronic device including a conductive oxide layer which is formed by epitaxial growth with cubic crystal (100) orientation or pseudo-cubic crystal (100) orientation and which contains a metal oxide having a perovskite structure, a method for manufacturing a substrate for an electronic device, and an electronic device provided with such a substrate for an electronic device. A substrate for an electronic device includes a Si substrate, a buffer layer which is formed by epitaxial growth on the Si substrate and which contains a metal oxide having a NaCl structure, and a conductive oxide layer which is formed by epitaxial growth with cubic crystal (100) orientation or pseudo-cubic crystal (100) orientation on the buffer layer and which contains a metal oxide having a perovskite structure. The Si substrate is preferably a (100) substrate or a (110) substrate from which a natural oxidation film is not removed. The buffer layer preferably has an average thickness of 10 nm or less.
A method for manufacturing a substrate for an electronic device, comprising:
Dependencies are inferred from the claim text.