Method for making a semiconductor multi-package module having inverted bump chip carrier second package
AssigneeChipPAC, Inc.
InventorsMarcos Karnezos, Flynn Carson
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Abstract
A semiconductor multi-package module has stacked lower and upper packages, each of which includes a die attached to a substrate, in which the second package is inverted, in which the upper and lower substrates are interconnected by wire bonding, and in which the inverted second package comprises a bump chip carrier package. Also, a method for making a semiconductor multi-package module, by providing a lower molded package including a lower substrate and a die, affixing an upper bump chip carrier package including an upper substrate in inverted orientation onto the upper surface of the lower package, and forming z-interconnects between the upper and lower substrates.
Claims6
A method for making a multi-package module, comprising
- providing a first package,
- providing a bump chip carrier second package, wherein the bump chip carrier or package comprises a die electrically connected to a substrate by wire bonds, and wherein the wire bonds are molded or encapsulated,
- inverting the second package and stacking the second package over the first package, and
- forming electrical interconnects between the first package and the second package by wire bonding.
Dependencies are inferred from the claim text.