Method and apparatus for a dual substrate package
AssigneeIntel Corporation
InventorsChristopher L. Rumer, Kuljeet Singh
Life of this patent
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Abstract
A semiconductor die having a through via formed therein is disclosed. A first conductive layer is formed on the front side of the die and a second conductive layer is formed on the backside of the die, and coupled with the through via. A first package substrate is electrically coupled with the first conductive layer, and a second package substrate is electrically coupled with the second conductive layer. In another embodiment, a substrate ball electrically couples the first and second package substrates. In a further embodiment, a flip chip bump is attached to the first package substrate.
Claims15
An apparatus, comprising:
- a semiconductor die including active circuitry formed on a frontside and having a plurality of conductive through vias formed therein from the frontside to a backside, the die comprising a power requirement and an external signal requirement;
- a plurality of first interconnects formed on a frontside of the die and a plurality of second interconnects formed on a backside of the die, respective ones of the plurality of second interconnects coupled to the plurality of through vias;
- and
- a first package substrate electrically coupled to the plurality of first interconnects and a second package substrate electrically coupled to the plurality of second interconnects,
- wherein a portion of at least one of the power requirement and the external signal requirement is supplied through the first package substrate and a remainder portion of at least one of the power requirement and the external signal requirement is supplied through the second package substrate.
A method, comprising:
- forming a plurality of conductive through vias in a back side of a semiconductor die including active circuitry on a frontside and coupling a plurality of first interconnects to respective ones of the plurality of through vias;
- coupling a plurality of second interconnects to a frontside of the die;
- electrically coupling the plurality of first interconnects to a first substrate;
- and
- electrically coupling the plurality of second interconnects to a second substrate,
- wherein a portion of at least one of a power requirement of the die and an external signal requirement of the die is supplied through the first substrate and a remainder portion of at least one of the power requirement and the external signal requirement is supplied through the second substrate.
An apparatus comprising:
- a die including device circuitry on a first side and a second side opposite the front side;
- a plurality of contact points on the second side of the die;
- and
- a plurality of conductive through vias coupling the device circuitry to the contact points,
- wherein a portion of at least one of a power requirement and an external signal requirement of the die may be met through electrical connections to the contact points.
Dependencies are inferred from the claim text.