Light emitting device and method of manufacturing the same
AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorShunpei Yamazaki
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Abstract
A light emitting device is provided in which reduction of recombinations in a light emitting element is prevented by using a low-resistant electrode structure. A light emitting device of the present invention has a light emitting element composed of first and second electrodes and an organic compound layer that is sandwiched between the first and second electrodes, and the device is characterized in that one of the first and second electrodes has a transparent conductive film, a transparent conductive resin formed on the transparent conductive film, and a plurality of conductors formed on the transparent conductive resin.
Claims23
A method of manufacturing a light emitting device, said method comprising:
- forming an organic compound layer over a first surface of a substrate;
- forming a transparent conductive resin over the organic compound layer;
- forming at least a conductor over a second surface of a cover member;
- opposing the first surface of the substrate and the second surface of the cover member;
- and
- bonding the substrate and the cover member with a seal pattern.
A method of manufacturing a light emitting device, said method comprising:
- forming an organic compound layer over a first surface of a substrate;
- forming at least a conductor over a second surface of a cover member;
- forming a seal pattern along end portions of the cover member;
- forming a transparent conductive resin inside the seal pattern over the cover member;
- opposing the first surface of the substrate and the second surface of the cover member;
- bonding the substrate and the cover member with the seal pattern.
A method of manufacturing a light emitting device, said method comprising:
- forming an electrode over a substrate;
- forming first and second insulating films over the electrode;
- forming an organic compound layer between the first and second insulating films, over the substrate;
- forming a transparent conductive resin over the first and second insulating films and the organic compound layer;
- forming at least a conductor over a cover member;
- and
- bonding the substrate and cover member with a seal pattern.
A method of manufacturing a light emitting device, said method comprising:
- forming an electrode over a substrate;
- forming first and second insulating films over the electrode;
- forming an organic compound layer between the first and second insulating films, over the substrate;
- forming a transparent conductive resin over the first and second insulating films and the organic compound layer;
- forming at least a conductor over a cover member;
- forming a seal pattern along end portions of the cover member;
- forming a transparent conductive resin inside the seal pattern over the cover member;
- and
- bonding the substrate and the cover member with the seal pattern.
Dependencies are inferred from the claim text.