Method for manufacturing solid-state imaging devices

A method for manufacturing a solid-state imaging device which comprises a wiring board made of an insulating resin, frame-shaped ribs forming an internal space, the frame-shaped ribs being disposed on top of the wiring board, a plurality of wiring members for electrically conducting to an external portion from the internal space of a housing formed of the wiring board and the ribs, an imaging element fastened to the wiring board inside the internal space, a transparent plate fastened to an upper surface of the ribs, and connecting members which connect electrodes of the imaging element with the wiring members;

• the method comprising:
• resin molding a lattice-shaped rib forming member, which is an aggregation of a plurality of frame-shaped ribs for configuring a plurality of solid-state imaging devices, with a cross sectional shape of the rib having a taper in a vertical direction;
• using an aggregate wiring board, which has regions corresponding to a plurality of the wiring boards, and in which a plurality of the wiring members are provided in each of the regions;
• fastening an imaging element to each region of the aggregate wiring board and connecting by the connecting members the electrodes of the imaging elements and the wiring members;
• placing the rib forming member on the wiring board face and joining the rib forming member with the wiring board face, so that the imaging element is disposed inside the lattice elements of the rib forming member and the rib forming member is fastened to a wiring board face such that a narrow side of the ribs faces the wiring board;
• fastening the transparent plate to an upper face of the rib forming member on a broader side of the rib;
• and
• cutting each housing in a direction perpendicular to the base portion, and in a direction dividing into two the width of the rib forming member, and separating the solid-state imaging devices into individual pieces.