Semiconductor device with intermediate connector

A method for manufacturing a semiconductor device with a semiconductor section and a substrate electrically connected, comprising:

• a forming process which forms semiconductor electrodes at the semiconductor section,
• a forming process which forms substrate electrodes on the circuit substrate,
• a first affixing process which affixes one part of the semiconductor section and the circuit substrate to an intermediate connector made of insulating material,
• a forming process which forms via holes with inclined wall surface thereof in the intermediate connector according to positions of the semiconductor electrodes and positions of the substrate electrodes,
• a connecting process which electrically connects each of the semiconductor electrodes and each of the substrate electrodes via each of the via holes,
• a second affixing process which affixes the other part of the semiconductor section and the circuit substrate to the intermediate connector;
• a forming process which forms bumps on at least one of the semiconductor electrodes and the substrate electrodes, wherein each bump has a tapered shape;
• a filling process which fills conductive paste into the each via hole;
• and
• a connecting process which buries each of the bumps in the conductive paste in the each via hole to electrically connect the each semiconductor electrode and the each substrate electrode via the each bump and the conductive paste.