Adhesive for bonding circuit members, circuit board, and method of producing the same
AssigneeHitachi Chemical Company, Ltd.
InventorsItsuo Watanabe, Kenzo Takemura, Akira Nagai, Kazuhiro Isaka, Osamu Watanabe, Kazuyoshi Kojima
Life of this patent
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Abstract
An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing 100 parts by weight of an adhesive resin composition and 10 to 200 parts by weight of an adhesive resin composition and 10 to 200 parts by weight of an inorganic filler, a circuit board in which the circuit members are bonded together with the adhesive, and a method of producing the circuit board.
Claims17
An adhesive film for bonding circuit members, said adhesive film adapted to be put between circuit electrodes facing each other, with said circuit electrodes facing each other being pressed interposing the adhesive film between them, to interconnect the electrodes electrically in the direction of pressing,
- wherein said adhesive film comprises:
- a first adhesive layer which includes an adhesive resin composition and an insulative inorganic filler;
- said insulative inorganic filler being contained in an amount of from 10 to 200 parts by weight based on 100 parts by weight of the adhesive resin composition;
- said adhesive film having an average coefficient of thermal expansion of 200 ppm/° C. or below at 110 to 130° C. after curing;
- and
- the adhesive film further comprising conductive particles in an amount of from 0.1 to 30 parts by volume based on 100 parts by volume of the adhesive resin composition.
An adhesive film for bonding circuit members, said adhesive film adapted to be put between circuit electrodes facing each other;
- said circuit electrodes facing each other being pressed interposing the adhesive between them, to interconnect the electrodes electrically in the direction of pressing,
- wherein said adhesive film comprises:
- a multi-layer constitution having a third adhesive layer and a fourth adhesive layer which have physical properties different in value from each other,
- wherein said third adhesive layer has a coefficient of thermal expansion at 30° to 100° C., of from 20 to 70 ppm/° C., and
- wherein at least one layer of said third and fourth adhesive layers contains an adhesive resin composition and an insulative inorganic filler in an amount of from 10 to 200 parts by weight based on 100 parts by weight of the adhesive resin composition.
Dependencies are inferred from the claim text.