Mold and method of molding semiconductor devices
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsJen-Chieh Kao, Kuo-Chung Yee
Life of this patent
Estimating the term…
Abstract
A mold for molding semiconductor devices mounted on a package substrate is provided. The mold comprises a top mold and a bottom mold. The top mold has a top runner, at least a first dummy runner and a plurality of mold cavities. The first dummy runner connects with the top runner and the top runner extends into a space between the mold cavities. The mold cavities for accommodating the semiconductor devices are connected to the top runner. The bottom mold has a bottom runner and at least a second dummy runner. The second dummy runner connects with the bottom runner. The second dummy runner is above but separated from the first dummy runner by the package substrate.
Claims17
A mold for encapsulating semiconductor devices mounted on a packaging substrate, the mold comprising:
- a top mold having a top runner, at least a first dummy runner connected to the top runner, a plurality of mold cavities and a plurality of second dummy cavities, wherein the mold cavities are connected to the top runner and located correspondingly to the semiconductor devices, and the second dummy mold cavities are connected to both ends of the top runner;
- and
- a bottom mold having at least a second dummy runner.
A method of encapsulating semiconductor devices, comprising the steps of:
- providing a packaging substrate having a first surface and a second surface, wherein the first surface of the packaging substrate has the semiconductor devices disposed thereon;
- placing the packaging substrate inside a mold;
- and
- injecting a molding material into the mold so that a plurality of molding compounds are formed on the first surface of the packaging substrate, wherein at least a first vertical rib and a first horizontal rib are formed on the first surface and at least a second vertical rib and a second horizontal rib are formed on the second surface simultaneously and aligned to the first vertical rib and die first horizontal rib in relation to the packaging substrate.
Dependencies are inferred from the claim text.