Method for manufacturing a fast heat rise resistor
AssigneeVishay Intertechnology, Inc.
InventorsGeorge V. Gerber, Anthony E. Troianello, Haim Goldberger
Life of this patent
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Abstract
A fast heat rise resistor comprising a substrate, a foil bridge on the surface of the substrate, the foil bridge having an elevated portion and a contact portion, the elevated portion above the substrate, the contact portion in contact with the substrate, a conductive layer attached to the contact portion of said foil bridge. The activation energy and/or response time is reduced as the foil bridge is suspended over the substrate. Another aspect of the invention include a method of manufacturing the foil bridge and application to autoignition vehicle airbags.
Claims9
A method of manufacturing a fast heat rise resistor comprising,
- affixing a layer of a film to a substrate;
- applying a photoresist print and developing process to selectively remove portions of the film;
- affixing a conductor plated foil to the film and the substrate, wherein at least a portion of the conductor plated foil directly contacts the substrate;
- and
- selectively etching away portions of the conductor plating and the foil to leave a foil trace of a certain width.
A method of manufacturing a fast heat rise resistor comprising, affixing a layer of a film to a substrate;
- applying a photoresist print and developing process to selectively remove portions of the film;
- affixing a conductor plated foil to the film and the substrate;
- selectively etching away portions of the conductor plating to leave a foil trace wherein the foil trace's upper and lower surfaces are exposed to an atmosphere;
- and
- selectively etching away portions of said foil trace to leave a foil trace of a certain width.
Dependencies are inferred from the claim text.