Dual outlet nozzle for the combined edge bead removal and backside wash of spin coated wafers

A method of cleaning chemical residue from spin coated semiconductor wafers, the method comprising:

• selecting a first semiconductor wafer to be cleaned;
• spinning said semiconductor wafer within a plane;
• providing a semiconductor wafer cleaning system, said semiconductor wafer cleaning system comprising a nozzle having a plurality of outlets, wherein each of said outlets is configured for the ejection of cleaning fluid onto the semiconductor wafer in a direction that is distinct from the ejection direction of every other nozzle outlet, and wherein at least one of said plurality of outlets is situated on a beveled top surface of said nozzle;
• and
• ejecting cleaning fluid simultaneously in a plurality of distinct directions from said nozzle.

A method for removing an edge bead of a coating material from the surface of a semiconductor wafer, comprising:

• spinning said semiconductor wafer within a substantially horizontal plane;
• and
• dispensing a solvent onto a plurality of locations on the backside of said semiconductor wafer,
• wherein said solvent is dispensed by a single nozzle mounted to a stationary arm, said nozzle having exactly two outlets separated by an angle of about 90 degrees, and
• wherein at least a portion of coating material on the backside or edge of said semiconductor wafer is removed.

A method for distributing fluid to a surface of a semiconductor wafer during a manufacturing process, comprising:

• selecting a first semiconductor wafer to be processed;
• positioning a nozzle at a first distance from a surface of said first semiconductor wafer and a second distance from an edge of said semiconductor wafer, said nozzle having exactly two outlets separated by an angle of about 90 degrees and adapted such that fluid can be ejected in a plurality of distinct directions from said nozzle simultaneously;
• mounting said nozzle to a stationary arm such that each of said outlets is adapted to eject fluid onto said first semiconductor wafer at an angle of about 45 degrees with respect to a primary axis of said stationary arm;
• spinning said first semiconductor wafer within a plane;
• and
• distributing said fluid to a plurality of locations on said surface of said first semiconductor wafer, wherein at least a portion of said fluid is ejected in a plurality of distinct directions from said nozzle simultaneously.

A method of conducting a simultaneous edge bead removal and backside wash of a spin coated semiconductor wafer, comprising:

• spinning a semiconductor wafer within a substantially horizontal plane;
• providing a semiconductor wafer cleaning system having a nozzle mounted to an edge bead removal stationary arm, said nozzle having a plurality of outlets, wherein each of said plurality of outlets is configured to eject cleaning fluid onto said semiconductor wafer in a direction that is distinct from the ejection direction of every other nozzle outlet, and wherein at least one of said plurality of outlets is situated on a beveled top surface of said nozzle;
• and
• dispensing a solvent onto the backside of said semiconductor wafer via said nozzle while said semiconductor wafer is spinning, wherein at least a portion of coating material on the backside of said semiconductor wafer is washed away via solvent dispensed from a first outlet of said plurality of outlets, and wherein at least a portion of coating material forming an edge bead on the edge of said semiconductor wafer is simultaneously removed via solvent dispensed from a second separate outlet from said plurality of outlets.

A method of conducting a simultaneous edge bead removal and backside wash of a spin coated semiconductor wafer, comprising:

• spinning a semiconductor wafer within a substantially horizontal plane;
• providing a semiconductor wafer cleaning system having a nozzle mounted to an edge bead removal stationary arm, said nozzle having a plurality of outlet, wherein each of said plurality of outlets is configured to eject cleaning fluid onto said semiconductor wafer in a direction that is distinct from the ejection direction of every other nozzle outlet;
• and wherein said plurality of outlets consists of exactly two outlets on said nozzle;
• and
• dispensing a solvent onto the backside of said semiconductor wafer via said nozzle while said semiconductor wafer is spinning, wherein at least a portion of coating material on the backside of said semiconductor wafer is washed away via solvent dispensed from a first outlet of said plurality of outlets, and wherein at least a portioh of coating material forming an edge bead on the edge of said semiconductor wafer is simultaneously removed via solvent dispensed from a second separate outlet from said plurality of outlets.