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US 7,247,207 B2Granted
Vacuum processing apparatus
AssigneeHitachi High-Technologies Corporation
InventorsAkitaka Makino, Youji Takahashi, Minoru Soraoka, Hideki Kihara, Susumu Tauchi
Life of this patent
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Abstract
A vacuum processing apparatus includes a vacuum processing chamber having a processing table for supporting an object to be processed and carrying out processing using a gas. The vacuum processing chamber has an axisymmetric structure, including a double wall structure, and a gate valve for sealing an opening through which the object enters the processing chamber.
Claims13
A vacuum processing apparatus comprising:
- a vacuum container in which an inside thereof is evacuated and in which a wafer is processed using plasma therein;
- an inner chamber detachably disposed inside the vacuum container and having an inner space in which a wafer table for supporting the wafer thereon is disposed and in which a processing gas is supplied, the inner chamber having an axisymmetric structure;
- a side wall delimiting a part of the inner chamber and having an opening disposed therein through which the wafer to be supported on the wafer table is passed;
- a gate disposed so as to enable communication with the opening in the side wall of the inner chamber so as to enable transfer of the wafer from outside of the vacuum container to the inner space of the inner chamber through the opening in the side wall;
- and
- a valve disposed between the opening in the side wall and the gate, the valve being movable with respect to the outside of the side wall of the inner chamber so as to open and close the opening and for sealing the opening in an airtight manner, a portion of the valve having a shape which does not interfere with the axisymmetric structure of the inner chamber.
3 more elements
Dependencies are inferred from the claim text.