Bonded three dimensional laminate structure
AssigneeTyco Electronics Corporation
InventorsRobert Daniel Hilty, Marjorie Kay Myers, Michael Fredrick Laub
Life of this patent
Estimating the term…
Abstract
A conductive structure and method of manufacturing therefor includes a plurality of stacked metal laminates secured to one another via an intermetallic bond made from a metallic bonding agent.
Claims18
A conductive structure comprising a plurality of stacked metal laminates secured to one another via a conductive bonding agent of metal material, the bonding agent of metal material forming an intermetaltic bond between the stacked metal laminates, the bond being formed without diffusing bonding of the stacked laminates, wherein said plurality of laminates are of a first metal, said bonding agent is of a second metal different from said first metal, and said intermetallic bond is represented by a third metal that is a combination of said first metal and said second metal.
A housing for an electrical connector including a plurality of electrical contacts, said housing comprising:
- a plurality of conductive laminates, each of said plurality of laminates defining a plurality of apertures;
- wherein said laminates are substantially aligned with one another in a stacked arrangement, and said plurality of laminates are monolithically formed into a conductive structure via an intermetallic bonding process with a bonding agent of metal material that is reacted with said laminates to secure the laminates to one another without diffusion bonding techniques, said apertures of said laminates defining cavities to receive the electrical contacts, and wherein said plurality of laminates are of a first metal, said bonding agent is of a second metal different from said first metal, and said intermetallic bond is represented by a third metal that is a combination of said first metal and said second metal.
Dependencies are inferred from the claim text.