Connector for making electrical contact at semiconductor scales
AssigneeNeoconix, Inc.
InventorsDirk D. Brown, John D. Williams, Eric M. Radza
Life of this patent
Estimating the term…
Abstract
A connector for electrically connecting to pads formed on a semiconductor device includes a substrate and an array of contact elements of conductive material formed on the substrate. Each contact element includes a base portion attached to the top surface of the substrate and a curved spring portion extending from the base portion and having a distal end projecting above the substrate. The curved spring portion is formed to curve away from a plane of contact and has a curvature disposed to provide a controlled wiping action when engaging a respective pad of the semiconductor device.
Claims35
A connector for electrically connecting to pads formed on a semiconductor device, comprising:
- a substrate;
- an electrical circuit embedded within the substrate, a surface of the substrate exposing an exposed portion of the embedded electrical circuit:
- a plurality of electrically conductive contact elements disposed on the surface of the substrate, at least one of said contact elements comprising
- a base portion adhered to the substrate by a conductive adhesion layer and
- a spring portion projecting away from the substrate, the conductive adhesion layer adhered to the exposed portion of the embedded electrical circuit and extending along the substrate underneath and apart from the spring portion;
- the electrical circuit being electrically connected to the at least one of said contact elements through the conductive adhesion layer, and
- the at least one of said contact elements formed on and electrically connected to the conductive adhesion layer by metal film deposition.
A connector for electrically connecting to solder balls of a ball grid array device, comprising:
- a substrate;
- an electrical circuit embedded within the substrate, a surface of the substrate exposing an exposed portion of the embedded electrical circuit;
- a plurality of electrically conductive contact elements disposed on the surface of the substrate, at least one of said contact elements comprising
- a base portion adhered to the substrate by a conductive adhesion layer and
- a spring portion projecting away from the substrate, the conductive adhesion layer adhered to the exposed portion of the embedded electrical circuit and extending along the substrate underneath and apart from the spring portion;
- the electrical circuit being electrically connected to the at least one of the said contact elements through the conductive adhesion layer, and
- the at least one of said contact elements formed on and electrically connected to the conductive adhesion layer by metal film deposition.
Dependencies are inferred from the claim text.