Electrically-isolated interconnects and seal rings in packages using a solder preform

A method for forming an assembly including an electronic device having a lid, comprising:

• forming an assembly including an electronic device on a substrate;
• forming a plurality of bonding pads electrically coupled to the electronic device;
• forming a seal ring wetting layer on the substrate, the seal ring wetting layer surrounding the electronic device;
• positioning a single piece solder preform on the bonding pads and seal ring wetting layer, the single piece solder preform including a seal ring region and a bonding pad region, the seal ring region being connected to the bonding pad region by a plurality of solder bridges;
• heating the single piece solder preform to a temperature of at least the solder reflow temperature, so that the bridges split and the solder from the preform accumulates on the seal ring wetting layer to form a solder seal ring and accumulates on the bonding pads to form solder bonding pad interconnects;
• and
• positioning a lid to cover the electronic device, and coupling the lid to the assembly;
• wherein the heating the single piece solder preform to a temperature of at least the solder reflow temperature comprises a first reflow operation, and wherein the coupling the lid to the assembly is carried out after the first reflow operation, using a second reflow operation in which the solder is heated to a temperature of at least the solder reflow temperature to couple the lid to the solder.

A method including an electronic device having a lid, comprising:

• forming an assembly including an electronic device on a substrate;
• forming a plurality of bonding pads electrically coupled to the electronic device;
• forming a seal ring wetting layer on the substrate, the seal ring wetting layer surrounding the electronic device;
• positioning a single piece solder preform on the bonding pads and seal ring wetting layer, the single piece solder preform including a seal ring region and a bonding pad region, the seal ring region being connected to the bonding pad region by a plurality of solder bridges;
• heating the single piece solder preform to a temperature of at least the solder reflow temperature, so that the bridges split and the solder from the preform accumulates on the seal ring wetting layer to form a solder seal ring and accumulates on the bonding pads to form solder bonding pad interconnects;
• and
• positioning a lid to cover the electronic device and coupling the lid to the assembly;
• wherein the seal ring wetting layer and the bonding pads are formed simultaneously and from the same material.

A method including an electronic device having a lid, comprising:

• forming an assembly including an electronic device on a substrate, the assembly including a region to be covered by a lid;
• forming a plurality of bonding pads electrically coupled to the electronic device;
• forming a seal ring wetting layer on the substrate, the seal ring wetting layer surrounding the electronic device;
• positioning a single piece solder preform on the bonding pads and seal ring wetting layer, the single piece solder preform including a seal ring region and a bonding pad region, the seal ring region being connected to the bonding pad region by a plurality of solder bridges;
• heating the single piece solder preform to a temperature of at least the solder reflow temperature, so that the bridges split and the solder from the preform accumulates on the seal ring wetting layer to form a solder seal ring and accumulates on the bonding pads to form solder bonding pad interconnects;
• and
• forming a wetting layer on a portion of a lid and then positioning the lid to cover the electronic device and coupling the lid to the assembly;
• wherein the wetting layer on a portion of the lid is formed from the same material as the seal ring wetting layer and the bonding pads.