Method for manufacturing a probe card
AssigneeAdvantest Corporation
InventorsKoichi Wada, Yasuhiro Maeda
Life of this patent
Estimating the term…
Abstract
A method for manufacturing a probe card includes a first contact formation step of forming a first contact on a first surface of a first sacrificial substrate, a second contact formation step of forming a second contact on a first surface of a second sacrificial substrate, a signal transmission line formation step of forming a signal transmission line in the base substrate, a first contact joining step of attaching the first surface of the first sacrificial substrate to the base substrate and joining the first contact to the signal transmission line, and a second contact joining step of attaching the first surface of the second sacrificial substrate to the base substrate and joining the second contact to the signal transmission line.
Claims12
A method for manufacturing a probe card, which comprises a contact provided on a base substrate and electrically coupled to a terminal of an electronic device, for receiving and/or sending a signal from and/or to said electronic device, comprising:
- a first contact formation step of forming a first contact on a first surface of a first sacrificial substrate;
- a second contact formation step of forming a second contact on a first surface of a second sacrificial substrate;
- a signal transmission line formation step of forming a signal transmission line in said base substrate;
- a first contact joining step of attaching said first surface of said first sacrificial substrate to said base substrate and joining said first contact to said signal transmission line;
- a second contact joining step of attaching said first surface of said second sacrificial substrate to said base substrate and joining said second contact to said signal transmission line;
- and
- a first sacrificial substrate elimination step of eliminating said first sacrificial substrate after said first contact is coupled to said signal transmission line in said first contact joining step.
A method for manufacturing a probe card, which comprises a contact provided on a base substrate and electrically coupled to a terminal of an electronic device, for receiving and/or sending a signal from and/or to said electronic device, comprising:
- a first contact formation step of forming a first contact on a first surface of a first sacrificial substrate, said first contact including a first end which is fixed to the first surface of the first sacrificial substrate and a second end which is freely held at the outside of the first sacrificial substrate in a direction parallel to the first surface of the first sacrificial substrate;
- a second contact formation step of forming a second contact on a first surface of a second sacrificial substrate, said second contact including a third end which is fixed to the first surface of the second sacrificial substrate and a fourth end which is freely held at the outside of the second sacrificial substrate in a direction parallel to the first surface of the second sacrificial substrate;
- a signal transmission line formation step of forming a signal transmission line in said base substrate;
- a first contact joining step of attaching said first surface of said first sacrificial substrate to said base substrate and joining said first contact to said signal transmission line;
- and
- a second contact joining step of attaching said first surface of said second sacrificial substrate to said base substrate and joining said second contact to said signal transmission line.
Dependencies are inferred from the claim text.