Method for producing an exposed substrate
AssigneeGiesecke & Devrient GmbH
InventorWittich Kaule
Life of this patent
Estimating the term…
Abstract
Method for producing an exposed substrate, which has at least two different image areas. The substrate is provided with at least two photoresist layers, which are adjusted to the type of image areas to be produced.
Claims26
Method for producing a resist master having at least first and second image areas, said image areas being different from each other and at least one of said image areas having a diffraction structure, the method comprising the separate steps of:
- coating a substrate with a first photoresist being adjusted to the type of the first image area to be produced;
- exposing the first photoresist with radiation in the first image area;
- developing the first photoresist;
- applying a second photoresist layer onto the substrate, said second photoresist layer being adjusted to the type of the second image area to be produced;
- exposing the second photoresist with radiation in the second image area;
- developing the second photoresist;
- wherein the steps of exposing the first and the second photoresist with radiation include exposing diffraction structures in at least one of the first and the second photoresist layer;
- wherein for both the first photoresist layer and for the second photoresist layer, either a positive resist or a negative resist is selected respectively;
- and
- wherein in the case of a positive resist, at first the respective image area is exposed and then under the usage of a mask the surrounding area is exposed with radiation.
Method for producing a resist master, which has at least two different image areas, at least one of said image areas having a diffraction structure, wherein a substrate is provided with a photoresist layer, and the photoresist layer in one image area is exposed with light radiation and in the other image area with particle radiation.
Resist master with at least one photoresist layer, comprising a first image area which is exposed with light radiation, and a second image area which is exposed with particle radiation, at least one of said image areas having a diffraction structure.
Resist master comprising at least two photoresist layers, wherein each photoresist layer is exposed in at least one image area and the image areas in the two photoresist layers are exposed with different types of radiation, at least one of said image areas having a diffraction structure.
Resist master comprising at least one photoresist layer having a first image area, which has a first image area which is exposed with a grating image of zero-order, and a second image area which is exposed with a grating image of first-order.
Resist master comprising at least two photoresist layers, wherein each photoresist layer is exposed in at least one image area and the photoresist layers have a different layer thickness;
- wherein in each photoresist layer a zero-order grating image is exposed.
Method for producing a resist master, wherein onto an already structured carrier material an embossable lacquer layer is applied, in which a grating image is embossed.
Dependencies are inferred from the claim text.