Integrated circuit package with optimized mold shape
AssigneeNokia Corporation
InventorEsa Hussa
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Abstract
The invention relates to an integrated circuit package, in particular an integrated chip size package or an integrated chip scale package, comprising a substrate carrying a die, and connection elements, interconnection elements, connecting pins of said die with said connection elements, and a mold encapsulating said die on said substrate. To increase reliability and to reduce failure due to deformation stress, the invention provides said mold with reduced stiffness at areas located substantially at one of said interconnection elements providing increased flexibility of said package at said areas compared to other areas of said package.
Claims13
Integrated circuit package, in particular a ball grid array and a land grid array comprising:
- a substrate carrying a die and connection elements,
- interconnection elements connecting pins of said die with said connection elements, and
- a mold encapsulating said die on said substrate,
- wherein said mold has reduced thickness at areas of via connections to provide reduced stiffness,
- wherein said mold with reduced thickness covers the whole area located at said via connections providing increased flexibility of said package at said areas compared to other areas of said package;
- and
- wherein said areas within said mold are formed by providing round shaped step deformations.
Integrated circuit package, in particular a ball grid array and a land grid array comprising:
- a substrate carrying a die and connection elements,
- interconnection elements connecting pins of said die with said connection elements, and
- a mold encapsulating said die on said substrate,
- wherein said mold is provided with reduced stiffness at areas located substantially at areas of via connections providing increased flexibility of said package at said areas compared to other areas of said package, and
- wherein said areas within said mold are formed by providing round shaped step deformations.
Dependencies are inferred from the claim text.