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US 7,225,529 B2Granted
Bonding device
AssigneeInventec Appliances Corp.
InventorShun-Ping Wang
Life of this patent
Estimating the term…
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AssigneeInventec Appliances Corp.
InventorShun-Ping Wang
Estimating the term…
A bonding device. A plurality of bonding units each has a base and a fastening member. Each base has a first connecting portion, a second connecting portion, and a stopper. An electronic device has a circuit unit and a predetermined element. The circuit unit has several first positioning portions and the predetermined element has several second positioning portions. The first positioning portions and the second positioning portions are through holes. When the predetermined element is attached to the upper surface of the circuit unit by aligning the second positioning portions with the corresponding first positioning portions, the second connecting portion of the base is first fit into the first positioning portions of the circuit unit, then the fastening member passes through the second positioning portion of the predetermined element to couple with the fastening member by several turns. Thus, the predetermined element is fixed on the circuit unit.
A bonding device for connecting a circuit unit provided with a first positioning portion and a predetermined element provided with a second positioning portion, the bonding device comprising:
A bonding device for connecting a circuit unit provided with a first positioning portion and a first contacting surface and a predetermined element provided with a second positioning portion and a second contacting surface, the bonding device comprising:
Dependencies are inferred from the claim text.