Equipment and method for polishing both sides of a rectangular substrate

A double-sided polishing equipment configured to polish a rectangular substrate, comprising:

• a carrier having a pocket configured to accommodate a rectangular substrate;
• a lateral linear moving mechanism configured to move the carrier;
• first and second polishing pads with first and second offset rotational axes, respectively, the first and second offset rotational axes being offset from each other and from centers of the polishing pads, polishing surfaces of the first and second polishing pads being parallel;
• an elevating mechanism coupled to at least one of the polishing pads;
• first and second rotary drive mechanisms coupled to each of the first and second polishing pads, respectively, and configured to rotate the first and second polishing pads about the first and second offset rotational axes, respectively;
• and
• a polishing agent supplying device configured to supply polishing agent to a plane where a rectangular substrate that is accommodated in the pocket to accommodate the rectangular substrate comes into contact with the polishing pads.