On-chip transistor degradation monitoring
AssigneeIntel Corporation
InventorJonathan H. Liu
Life of this patent
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Abstract
Embodiments of the invention include on-chip characterization of transistor degradation. In one embodiment, includes one or more functional blocks to perform one or more functions and an integrated on-chip characterization circuit to perform on-chip characterization of transistor degradation. The integrated on-chip characterization circuit includes a selectively enabled ring oscillator to generate a reference oscillating signal, a free-running ring oscillator to generate a free-running oscillating signal, and a comparison circuit coupled to the selectively enabled ring oscillator and the free-running ring oscillator. From the reference oscillating signal and the free-running oscillating signal, the comparison circuit determine a measure of transistor degradation.
Claims29
An integrated circuit comprising:
- one or more functional blocks to perform one or more functions;
- and
- an integrated on-chip characterization circuit including
- a selectively enabled ring oscillator to generate a reference oscillating signal,
- a free-running ring oscillator to generate a free-running oscillating signal, and
- a comparison circuit coupled to the selectively enabled ring oscillator and the free-running ring oscillator, the comparison circuit to periodically determine a measure of transistor degradation including at least one of p-channel metal oxide semiconductor field effect transistor bias temperature (PMOS BT) degradation and hot electron transistor degradation;
- wherein the selectively enabled ring oscillator and the free-running ring oscillator are located in the same area of the integrated circuit.
A method in an integrated circuit with functional blocks, the method comprising:
- generating a free-running oscillation signal to degrade transistors in a first ring oscillator,
- selectively generating a reference oscillation signal in a second ring oscillator, and
- periodically comparing the free-running oscillation signal with the reference oscillation signal to characterize the transistor degradation in the transistors of the integrated circuit, the transistor degradation including at least one of p-channel metal oxide semiconductor field effect transistor bias temperature (PMOS BT) degradation and hot electron transistor degradation;
- wherein the first ring oscillator and the second ring oscillator are located in the same area of the integrated circuit.
A system comprising:
- a processor for executing instructions and processing data, transistors of the processor to experience transistor degradation over time;
- an integrated on-chip characterization circuit to determine a measure of transistor degradation in the transistors of the processor, the integrated on-chip characterization circuit including
- at least one free-running ring oscillator to generate a free-running oscillating signal,
- at least one selectively enabled ring oscillator to generate a reference oscillating signal, and
- a comparison circuit coupled to the selectively enabled ring oscillator and the free-running ring oscillator, the comparison circuit to periodically determine the measure of transistor degradation in the transistors of the processor, the transistor degradation including at least one of p-channel metal oxide semiconductor field effect transistor bias temperature (PMOS BT) degradation and hot electron transistor degradation;
- wherein the at least one selectively enabled ring oscillator and the at least one free-running ring oscillator are located in the same area of the integrated circuit.
An enabable ring oscillator comprising:
- an odd number of p-channel field effect transistors (PFETs) each having a gate, a drain, and a source;
- an odd number of n-channel field effect transistors (NFETs) each having a gate, a drain, and a source;
- the odd number of PFETs and the odd number of NFETs coupled together to form a daisy chain series of inverters with a switchable power supply;
- and
- wherein the drain of a last PFET of the odd number of PFETs and the drain of a last NFET of the odd number of NFETs coupled together to couple to gates of a first PFET of the add number of PFETs and first NFET of the odd number of NFETs;
- wherein the enabable ring oscillator to provide a reference frequency to a comparison circuit for a measurement of at least one of p-channel metal oxide semiconductor field effect transistor bias temperature (PMOS BT) degradation and hot electron transistor degradation.
Dependencies are inferred from the claim text.