Minimizing the effect of 1/ƒ noise with a MEMS flux concentrator

A method of fabricating a microelectromechanical system (MEMS) device, said method comprising:

• forming a magnetic sensor over a silicon on insulator (SOI) wafer, wherein said SOI wafer comprises a device layer over an intermediate layer over a handle layer;
• forming a pair of MEMS flux concentrators sandwiching said magnetic sensor;
• connecting an electrostatic comb drive to each of the MEMS flux concentrators;
• connecting at least one spring to said pair of MEMS flux concentrators and said electrostatic comb drive;
• performing a plurality of deep reactive ion etching (DRIE) processes on said SOI wafer;
• and
• releasing said MEMS flux concentrators, said electrostatic comb drive, and said at least one spring from said SOI wafer.

A method of fabricating a microelectromechanical system (MEMS) device, said method comprising:

• forming a first wafer;
• forming adhesive bumps on said first wafer;
• forming a magnetic sensor on said first wafer;
• forming a second wafer;
• forming a pair of MEMS flux concentrators, a pair of electrostatic comb drives, and at least one spring on said second wafer, wherein said pair of MEMS flux concentrators, said pair of electrostatic comb drives, and said at least one spring is connected to one another, and wherein said pair of MEMS flux concentrators sandwich said magnetic sensor;
• bonding said second wafer to said adhesive bumps;
• and
• compressing said adhesive bumps using non-thermal means.

A method of fabricating a microelectromechanical system (MEMS) device, said method comprising:

• forming a magnetic sensor over a silicon on insulator (SOI) wafer, wherein said SOI wafer comprises an epoxy layer;
• forming a MEMS flux concentrator proximate said magnetic sensor;
• connecting an electrostatic comb drive to the MEMS flux concentrator;
• connecting at least one spring to said MEMS flux concentrator and said electrostatic comb drive;
• performing a plurality of deep reactive ion etching (DRIE) processes on said SOI wafer;
• and
• releasing said MEMS flux concentrator, said electrostatic comb drive, and said at least one spring from said SOI wafer.