High throughput high-yield vacuum deposition system

A method for producing an optical filter utilizing line-of-sight deposition, the method comprising the steps of:

• providing multiple substrates;
• providing a fixed ion source;
• providing at least one selectively movable evaporator, the evaporator providing energy for evaporation of material to be deposited and being moveable between a source deposition location and a stand-by location spaced apart from the source deposition location;
• moving the at least one evaporator to the source deposition location;
• and,
• depositing material onto the substrates.

A method of making an optical filter by ion assisted deposition comprising the steps of:

• mounting one or more substrates in a deposition chamber;
• mounting an ion source within the chamber;
• moving a first evaporator to a source deposition location within the chamber proximate the ion source, the first evaporator being adapted to provide energy for evaporation of a first material to be deposited;
• moving a second evaporator to a stand-by location within the chamber remote from the ion source, the second evaporator being adapted to provide energy for evaporation of a second material to be deposited;
• depositing a first material from the first evaporator on the one or more substrates;
• ceasing deposition of the first material;
• moving the first evaporator to a stand-by location within the chamber remote from the ion source;
• moving the second evaporator to the source deposition location;
• depositing a second material from the second evaporator on the one or more substrates;
• and
• ceasing deposition of the second material.

A method of making an optical filter by ion assisted deposition comprising the steps of:

• exposing one or more substrates to a first evaporator adapted to provide energy to evaporate a first material to be deposited positioned at a source deposition location;
• shielding the one or more substrates from a second evaporator positioned at a stand-by location laterally spaced from the source deposition location;
• depositing a layer of a first material on the one or more substrates;
• exposing the one or more substrates to the second evaporator adapted to provide energy to evaporate a second material to be deposited positioned at the source deposition location;
• shielding the one or more substrates from the first evaporator positioned at the stand-by location;
• and
• depositing a layer of second material on the one or more substrates.

A method comprising the steps of:

• providing a deposition chamber;
• positioning a generally planar substrate carrier proximate one end of the chamber, the substrate carrier being adapted to carry an array of substrates;
• positioning a generally planar electron gun carrier proximate the other end of the chamber, the electron gun carrier being substantially parallel to the substrate carrier;
• providing a source deposition location on the electron gun carrier;
• providing a stand-by location on the electron gun carrier, the stand-by location being spaced laterally from the source deposition location;
• positioning an electron gun on the electron gun carrier, the electron gun being adapted to provide energy for evaporation of material to be deposited on the substrates and being moveable between the source deposition location and the stand-by location;
• and
• positioning an ion source proximate the source deposition location.