Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages
AssigneeInternational Business Machines Corporation
InventorsRaschid Jose Bezama, Evan George Colgan, John Harold Magerlein, Roger Ray Schmidt
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Abstract
Apparatus and methods are provided for microchannel cooling of electronic devices such as IC chips, which enable efficient and low operating pressure microchannel cooling of high power density electronic devices. Apparatus for microchannel cooling include integrated microchannel heat sink devices and fluid distribution manifold structures that are designed to provide uniform flow and distribution of coolant fluid and minimize pressure drops along coolant flow paths.
Claims29
An apparatus for cooling an electronic device, comprising:
- a manifold plate comprising a plurality of alternating input and output manifolds that extend in a same direction along the manifold plate, wherein at least one heat exchanger zone is defined between each adjacent input and output manifold, and wherein one or more of the manifolds extends in a zig-zag pattern, wherein each manifold comprises a manifold channel formed in a first surface of the manifold plate, and a plurality of vias that form openings in a second surface of the manifold plate opposite the first surface, which extend through the manifold plate to a plurality of locations along the manifold channel;
- and
- a microchannel plate comprising a pattern of microfins that define microchannels formed in a first surface of the microchannel plate, wherein the microchannels extend in a same direction along the microchannel plate,
- wherein the first surface of the manifold plate is coupled to the first surface of the microchannel plate such that the microchannels are positioned to provide fluid flow between adjacent manifolds.
An apparatus for cooling an electronic device, comprising:
- an integrated microchannel cooler device comprising a plurality of a plurality of alternating input and output manifolds and a plurality of microchannels formed in a single silicon substrate,
- wherein the plurality of manifolds extend in a same direction across a region of the silicon substrate, wherein at least one heat exchanger zone of microchannels is defined between each adjacent input and output manifold, wherein one or more of the manifolds extends in a zig-zag pattern, and wherein each manifold comprises a manifold channel formed in a first surface of the silicon substrate, and a plurality of vias that form openings in a second surface of the silicon substrate opposite the first surface, which extend through the silicon substrate to a plurality of locations along the manifold channel, and
- wherein the plurality of microchannels are defined by microfins that are formed in the first surface of the silicon substrate between adjacent manifolds, and wherein the microchannels are positioned to provide fluid flow between adjacent manifolds.
An apparatus for cooling an electronic device, comprising:
- an integrated circuit (IC) chip comprising a non-active surface and an active surface, wherein the IC chip is flip-chip bonded to a package substrate;
- an integrated microchannel cooler device rigidly bonded with a low thermal resistance such as below about 0.2 C-cm2/W, or more preferable less than or equal to about 0.1 C-cm2/W, to the non-active surface of the IC chip;
- and
- a fluid distribution manifold device coupled to the integrated microchannel cooler device with a compliant gasket;
- wherein the integrated microchannel cooler device and fluid distribution manifold device each comprise a plurality of variable cross-section flow channels formed therein for providing uniform flow and distribution of coolant fluid that flows through the integrated microchannel cooler device and fluid distribution manifold device.
Dependencies are inferred from the claim text.