Substrate layer cutting device and method

An automatic high-precision cutting method for separating a layer of material from a source substrate comprising:

• providing a semiconductor substrate having a weakened area, a sidewall and a notch in the sidewall, wherein the notch is positioned away from the weakened area;
• positioning at least a portion of the sidewall of the semiconductor substrate against a fixed positioning member while supporting the substrate on a support;
• contacting at least one blade with the notch of the semiconductor substrate to induce a cleaving wave into the substrate, the cleaving wave being of sufficient intensity to both divide the substrate at the notch into first and second parts and detach the layer from the substrate along the weakened area;
• and
• moving at least a portion of the support away from the substrate as the blade contacts the notch so that the positioning member and blade are the only structures supporting the substrate.

An automatic high-precision cutting method for separating a layer of material from a source substrate comprising:

• providing a semiconductor substrate with a first face, a second face, a side surface and a notch in the side surface;
• forming a weakened area in the semiconductor substrate which is located a distance from the notch;
• providing a fixed positioning member adjacent a first support;
• positioning at least a portion of the side surface of the a semiconductor substrate on the first support and against the positioning member;
• and
• contacting the substrate with at least one blade to induce a cleaving wave into the substrate, the cleaving wave being of sufficient intensity to both divide the substrate at the notch into upper and lower parts and detach the layer from the substrate along the weakened area without limiting upward movement of the upper part of the wafer during cleaving,
• wherein the positioning member prevents movement of the substrate as the blade contacts the substrate, and
• wherein the substrate is held in position between the positioning member and the blade without any support contacting the first and second faces.