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US 7,161,363 B2Granted
Probe for testing a device under test
AssigneeCascade Microtech, Inc.
InventorsK. Reed Gleason, Tim Lesher, Eric W. Strid, Mike Andrews, John Martin, John Dunklee, Leonard Hayden, Amr M. E. Safwat
Life of this patent
Estimating the term…
Abstract
A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.
Claims59
A probe comprising:
- (a) a dielectric substrate;
- (b) an elongate conductor suitable to be electrically interconnected to a test signal and contacting a first side of said substrate;
- (c) a conductive member suitable to be electrically interconnected to a ground signal and contacting a second side of said substrate wherein said conductive member is adjacent a majority of the length of said elongate conductor;
- (d) a conductive path between said first side of said substrate and said second side of said substrate and said conductive path free from electrical interconnection with said conductive member;
- (e) a contact electrically interconnected to said conductive path for testing a device under test;
- and
- (f) wherein said substrate has a thickness of less than 40 microns with a dielectric constant of less than 7.
4 more elements
A probe comprising:
- (a) a dielectric substrate supporting an elongate conductor on a first side of said substrate and a conductive member supported by a second side of said substrate wherein said conductive member is adjacent a majority of the length of said elongate conductor;
- (b) a conductive path between said first side of said substrate and said second side of said substrate;
- (c) a contact electrically interconnected to said conductive path for testing a device under test;
- and
- (d) wherein said substrate has a thickness of less than 40 microns with a dielectric constant of less than 7.
2 more elements
A probe comprising:
- (a) a dielectric substrate supporting an elongate conductor on a first side of said substrate and a conductive member supported by said second side of said substrate;
- (b) a conductive path between said first side of said substrate and said second side of said substrate;
- (c) a contact electrically interconnected to said conductive path for testing a device under test;
- and
- (d) a co-axial cable, comprising an inner conductor, a dielectric and outer conductor, interconnected to said dielectric substrate, and a pre-loading member that pre-loads said co-axial cable with a desired amount of force when said contact is free from being engaged with said device under test in such a manner that when force is applied to said probe it has a non-linear vertical deformation profile versus force applied.
2 more elements
A probe comprising:
- (a) a dielectric substrate supporting an elongate conductor;
- (b) a probing element electrically interconnected to said elongate conductor for testing a device under test;
- and
- (c) a co-axial cable, comprising an inner conductor, a dielectric and outer conductor, interconnected to said dielectric substrate, and a pre-loading member that pre-loads said co-axial cable with a desired amount of force when said contact is free from being engaged with said device under test in such a manner that when force is applied to said probe it has a non-linear vertical deformation profile versus force applied.
1 more element
A probe comprising:
- (a) a dielectric substrate supporting an elongate conductor on a first side of said substrate and supporting a conductive member on a second side of said substrate said conductive member adjacent a majority of the length of said elongate conductor;
- (b) a conductive path between said first side of said substrate and said second side of said substrate;
- (c) a contact electrically interconnected to said conductive path for testing a device under test;
- and
- (d) wherein said contact has a height relative to the adjoining surface of said dielectric substrate of less than 150 microns.
2 more elements
Dependencies are inferred from the claim text.