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US 7,160,583 B2Granted
Microfabrication using patterned topography and self-assembled monolayers
Assignee3M Innovative Properties Company
InventorsMatthew H. Frey, Khanh P. Nguyen
Life of this patent
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Abstract
A method of selectively and electrolessly depositing a metal onto a substrate having a metallic microstructured surface is disclosed. The method includes forming a self-assembled monolayer on the metallic microstructured surface, exposing the self-assembled monolayer to an electroless plating solution including a soluble form of a deposit metal, and depositing electrolessly the deposit metal selectively on the metallic microstructured surface. Articles formed from this method are also disclosed.
Claims33
A method comprising:
- forming a microstructure, with a mechanical tool, onto a substrate metallic surface, to form a metallic microstructured surface;
- forming a self-assembled monolayer on the metallic microstructured surface;
- exposing the self-assembled monolayer to an electroless plating solution comprising a soluble form of a deposit metal;
- and
- depositing electrolessly the deposit metal selectively on the metallic microstructured surface.
2 more elements
A method comprising:
- forming a microstructure, with a mechanical tool, onto a substrate surface, to form a substrate microstructured surface;
- disposing a metal layer on the substrate microstructured surface to form a metallic microstructured surface;
- forming a self-assembled monolayer on the metallic microstructured surface;
- exposing the self-assembled monolayer to an electroless plating solution comprising a soluble form of a deposit metal;
- and
- depositing electrolessly the deposit metal selectively on the metallic microstructured surface.
3 more elements
A method comprising:
- providing a substrate having a metallic microstructured surface;
- forming a self-assembled monolayer on the metallic microstructured surface;
- exposing the self-assembled monolayer to an electroless plating solution comprising a soluble form of a deposit metal selected from the group consisting of copper, nickel, gold, silver, palladium, rhodium, ruthenium, tin, cobalt, and zinc;
- and
- depositing electrolessly the deposit metal selectively on the metallic microstructured surface.
2 more elements
A method comprising:
- providing a substrate comprising a polymeric material and having a metallic microstructured surface disposed on the substrate;
- forming a self-assembled monolayer on the metallic microstructured surface;
- exposing the self-assembled monolayer to an electroless plating solution comprising a soluble form of a deposit metal;
- and
- depositing electrolessly the deposit metal selectively on the metallic microstructured surface.
2 more elements
Dependencies are inferred from the claim text.