High-frequency power amplifier
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorMasahiro Maeda
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AssigneeMatsushita Electric Industrial Co., Ltd.
InventorMasahiro Maeda
Estimating the term…
The present invention provides a compact and low-cost high-frequency power amplifier including GaAs heterojunction bipolar transistors (HBTs) but having a low level of noise in the transmission band. In the high-frequency power amplifier of the present invention, a chip capacitor 21 is connected at one end to an upstream stage bias circuit 107 via a bonding wire B1, and grounded at the other end. Also, a chip inductor 22 is connected to a base electrode of a high-frequency signal amplification HBT 101 via a bonding wire B2. In the high-frequency power amplifier of the present invention, the chip capacitor 21 causes noise generated within the upstream stage bias circuit 107 to flow to the ground, thereby reducing noise in the reception band. Also, the chip inductor 22 reduces a power loss of a high-frequency signal which is caused because the high-frequency signal flows to the ground.
A high-frequency power amplifier for amplifying a high-frequency signal, comprising:
A high-frequency power amplifier for amplifying a high-frequency signal, comprising:
A high-frequency power amplifier for amplifying a high-frequency signal, comprising:
A high-frequency power amplifier for amplifying a high-frequency signal, comprising:
Dependencies are inferred from the claim text.