Resilient probes for electrical testing

A method for electrical testing of a semiconductor device having a plurality of test members, comprising the steps of:

• providing an apparatus comprising:
• a segmented probe having a plurality of metal elements of about equal size bonded together in substantially linear sequence;
• an insulating holder having first and second surfaces and a plurality of metal-filled vias traversing said holder from said first to said second surface, said vias forming contact pads on said first and second surfaces, the location of the contact pads on said first surface matching the locations of said test pads of said semiconductor device;
• said contact pads of said first holder surface having a probe attached so that said probe is positioned about normal to said surface;
• a sheet of resilient insulating material having first and second surfaces and a thickness, traversed by a plurality of conducting traces, said first sheet surface attached to said second holder surface so that at least one of said traces contacts one of said contact pads, respectively, to provide an electrical path to said second sheet surface;
• and
• a printed circuit board suitable for insertion into an electrical test apparatus, said board attached to said second sheet surface so that a continuous electrical path is established from said apparatus to each of said probes;
• aligning said apparatus with said semiconductor device so that said probes are aligned with said test members, respectively;
• bringing said probes of said apparatus in contact with said test members so that said sheet of resilient material is compressed, whereby said probes break through any metal oxide layer on said test members;
• and
• providing sufficient time so that said resilient material returns elastically to its uncompressed state and said electrical testing can get started.