ALD of tantalum using a hydride reducing agent
AssigneeNovellus Systems, Inc.
InventorsJames A. Fair, Jungwan Sung, Nerissa Taylor
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AssigneeNovellus Systems, Inc.
InventorsJames A. Fair, Jungwan Sung, Nerissa Taylor
Estimating the term…
An ALD method deposits conformal tantalum-containing material layers on small features of a substrate surface. The method includes the following principal operations: depositing a thin conformal and saturated layer of tantalum-containing precursor over some or all of the substrate surface; using an inert gas or hydrogen plasma to purge the halogen byproducts and unused reactants; reducing the precursor to convert it to a conformal layer of tantalum or tantalum-containing material; using another purge of inert gas or hydrogen plasma to remove the halogen byproducts and unused reactants; and repeating the deposition/reduction cycles until a desired tantalum-containing material layer is achieved. An optional step of treating each newly formed surface of tantalum containing material with a nitrogen-containing agent can be added to create varying amounts of tantalum nitride.
A method of forming a layer of tantalum-containing material on a substrate, the method comprising:
Dependencies are inferred from the claim text.