Method for fabricating molded resinous part with metal distributed in surface thereof
AssigneeSharp Kabushiki Kaisha
InventorsToshiaki Oku, Hiroyuki Suga
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Abstract
A method for fabricating a molded resinous part with a metal distributed in a surface thereof comprising: kneading a low-melting metal and a resin having a curing temperature lower than a solidification point of the low-melting metal in a molten state; and injection-molding the resulting kneaded mixture into a mold whose temperature is set to a temperature equal to or lower than the solidification point of the low-melting metal and higher than the curing temperature of the resin, thereby obtaining a molded resinous part comprising the resin as a core and the low-melting metal in a surface thereof.
Claims11
A method for fabricating a molded resinous part with a metal distributed in a surface thereof comprising:
- kneading a low-melting-temperature metal and a resin having a curing temperature lower than a solidification point of the low-melting-temperature metal in a molten state to form a kneaded mixture;
- and
- injection-molding the resulting kneaded mixture into a mold whose temperature is set to a temperature equal to or lower than the solidification point of the low-melting-temperature metal and higher than the curing temperature of the resin, thereby obtaining a molded resinous part comprising the resin as a core and the low-melting-temperature metal as a thin conductive film of metal on an exterior surface of the core.
A method for fabricating a molded resinous part with a metal distributed in a surface thereof, the method comprising:
- kneading a low-melting metal and a resin having a curing temperature lower than a solidification point of the low-melting metal in a molten state;
- injection-molding the resulting kneaded mixture into a mold whose temperature is set to a temperature equal to or lower than the solidification point of the low-melting metal and higher than the curing temperature of the resin;
- and
- cooling the kneaded mixture to a temperature lower than the curing temperature through the mold to solidify the mixture, thereby obtaining a molded resinous part comprising the resin as a core and thin conductive film of the low-melting metal on an exterior surface of the core.
Dependencies are inferred from the claim text.