Molding apparatus with a molding flowability sensor for packaging semiconductor device
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsWei-Chih Wang, Kuang-Lin Lo, Yun-Lung Chang
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Abstract
A molding apparatus mainly comprises a mold chase holder, a mold chase, a heater and a molding flowability sensor. The mold chase comprises a mold cavity and a via, wherein the via penetrates a mold-cavity surface of the mold cavity. The mold chase is accommodated by a mold chase holder and there is a heater, for heating the mold chase up, disposed therein. And the molding flowability sensor for measuring the molding flowability of the instant molding flow at the mold-cavity surface of the mold cavity is provided at the mold-cavity surface of the mold cavity.
Claims3
A molding apparatus, comprising:
- a mold chase, the mold chase having a plurality of mold cavities, wherein each of the mold cavities has a mold-cavity surface;
- a mold chase holder;
- and
- a plurality of molding flowability sensors disposed at one of the mold-cavity surfaces, wherein the molding flowability sensors are arranged in a spiral type.
Dependencies are inferred from the claim text.