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US 7,138,767 B2Granted
Surface wave plasma processing system and method of using
AssigneeTokyo Electron Limited
InventorsLee Chen, Caiz Hong Tian, Naoki Matsumoto
Life of this patent
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Abstract
A SWP source includes an electromagnetic (EM) wave launcher configured to couple EM energy in a desired EM wave mode to a plasma by generating a surface wave on a plasma surface of the EM wave launcher adjacent the plasma. A power coupling system is coupled to the EM wave launcher and configured to provide the EM energy to the EM wave launcher for forming the plasma. A cover plate coupled to the plasma surface of the EM wave launcher protects the EM wave launcher from the plasma.
Claims26
A surface wave plasma (SWP) source comprising:
- an electromagnetic (EM) wave launcher configured to couple EM energy in a desired EM wave mode to a plasma by generating a surface wave on a plasma surface of said EM wave launcher adjacent said plasma;
- a power coupling system coupled to said EM wave launcher and configured to provide said EM energy to said EM wave launcher for forming said plasma;
- and
- a cover plate coupled to said plasma surface of said EM wave launcher, and configured to protect said EM wave launcher from said plasma.
1 more element
A surface wave plasma (SWP) source comprising:
- an electromagnetic (EM) wave launcher configured to couple EM energy in a desired EM wave mode to a plasma by generating a surface wave on a plasma surface of said EM wave launcher adjacent said plasma;
- a power coupling system coupled to said EM wave launcher and configured to provide said EM energy to said EM wave launcher for forming said plasma;
- and
- means, coupled to said plasma surface of said EM wave launcher, for protecting said EM wave launcher from said plasma.
1 more element
Dependencies are inferred from the claim text.