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US 7,138,667 B2Granted
High power light emitting diode
AssigneeWeldon Technologies, Inc.
InventorsThomas J. Barnett, Sean P. Tillinghast
Life of this patent
Estimating the term…
Abstract
An LED package is disclosed. The LED package comprises a base contact and a leadframe connected to the base contact. The leadframe includes an annular contact. An LED die is coupled to the base contact and the annular contact. A trim bezel is coupled to the leadframe. In various embodiments the LED package may include a lens, and an optical material disposed over the LED die. The trim bezel may be colored to generally indicate the color of light emitted by the LED die.
Claims31
An LED package, comprising:
- a leadframe comprising a base contact and an annular contact, the contacts being separated by an insulating member;
- and
- an LED die coupled to the base contact and the annular contact,
- wherein the LED package includes means for detachably coupling to at least one of a mounting device, a receiving device and a complementary coupling device.
1 more element
An LED package, comprising:
- a leadframe comprising a base contact and an annular contact, the contacts being separated by an insulating member, wherein the base contact has a die cup for coupling to an LED die and further includes a threaded portion to detachably couple the LED package to at least one of a mounting device, a receiving device and a complementary coupling device;
- an LED die coupled to the die cup and the annular contact;
- an optical material disposed over the LED die;
- and
- a trim bezel coupled to the leadframe.
2 more elements
Dependencies are inferred from the claim text.