Semiconductor device and an information management system therefore
AssigneeOki Electric Industry Co., Ltd.
InventorIsao Kudo
Life of this patent
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Abstract
According to the present invention, individual two-dimensional barcodes 30, 91 and 173 are provided for individual chips 31 arrayed on a wafer 50, individual lead fames 93 to each of which chips 92 are bonded and individual packaged products 171 constituted of resin sealed semiconductor chips based upon chip ID information to enable information management to be implemented separately for individual chips 31, individual frames 93 and individual chip products 171. Thus, a higher degree of efficiency and a higher degree of accuracy in the information management for semiconductor devices are achieved in all processes of semiconductor production including the individual manufacturing processes, the physical distribution process, the shipping process and the claim handling process.
Claims18
A management method for a production process of a semiconductor device comprising:
- providing information on production management consisting of a two-dimensional code pattern and another pattern both of which are marked on a plurality of semiconductor chips directly;
- recognizing a product name of the chips from said another pattern;
- and
- reading out the two-dimensional code pattern provided on the semiconductor chips in an information read device and using the read-out information to perform management of production processes.
A management method for a production process of a semiconductor device comprising:
- providing information on production management consisting of a two-dimensional code pattern and another pattern both of which are marked on a surface of a semiconductor device directly;
- recognizing a product name of the device from said another pattern;
- and
- reading out the two-dimensional code pattern provided on the semiconductor device in an information read device and using the read-out information to perform management of production processes.
A management method for a production process of a semiconductor device comprising:
- providing information on production management consisting of a two-dimensional code pattern and another pattern both of which are disposed on an outer surface of a resin sealant of a semiconductor device having a semiconductor chip and the resin for sealing the semiconductor chip;
- recognizing a product name of the device from said another pattern;
- reading out the two-dimensional code pattern provided on the outer surface of the resin sealant of the semiconductor device in an information reading device;
- and,
- using the read-out information and to perform management of production processes.
A management method for a semiconductor device comprising:
- providing information on a plurality of semiconductor devices, including:
- marking a two-dimensional code pattern on a surface of each of the semiconductor chips, and
- marking another pattern on the surface of each of the semiconductor chips;
- recognizing a product name of the semiconductor devices from said another pattern;
- and
- reading out the two-dimensional code pattern from the semiconductor devices so as to recognize information including an identification (ID) information of the semiconductor devices.
Dependencies are inferred from the claim text.