Surface mount crystal oscillator
AssigneeNihon Dempa Kogyo Co., Ltd.
InventorYukihiro Okajima
Life of this patent
Estimating the term…
Abstract
A surface mount quartz crystal oscillator comprises a package body having a recess, a quartz crystal blank having extending electrodes extending from the outer periphery of the crystal blank, an IC (integrated circuit) chip secured to an inner bottom surface of the recess and having at least an oscillator circuit connected to the crystal blank, and an insulator disposed on the IC chip. A pair of conduction terminals are disposed on an inner wall surface of the recess and electrically connected to the IC chip. The crystal blank is secured to the insulator with a conductive adhesive at positions from which the extending electrodes are extended, and the conductive adhesive electrically connects each extending electrode to one conduction terminal associated therewith.
Claims17
A crystal oscillator comprising:
- a package body having a recess formed by an inner side wall surface and an inner bottom surface surrounded by the inner side walls;
- a crystal blank having extending electrodes extending from an outer periphery of said crystal blank;
- an IC chip secured to the inner bottom surface of said recess and having at least an oscillator circuit connected to said crystal blank;
- an insulator bonded onto an upper surface of said IC chip;
- and
- conduction terminals disposed on the inner side wall surface of said recess and electrically connected to said IC chip,
- wherein both said crystal blank and said IC chip are accommodated in said recess, wherein said crystal blank is secured to said insulator with a conductive adhesive at positions from which extending electrodes are extended, and said conductive adhesive electrically connects each of said extending electrodes with each of said conduction terminals.
A crystal oscillator comprising:
- a package body having a recess having an inner bottom surface surrounded by an inner side wall surface on which conduction terminals are disposed;
- an IC chip containing at least an oscillator circuit, secured to the inner bottom surface of the recess, said IC chip having a top surface and electrically connected to the conduction terminals;
- an insulator plate bonded onto and covering the top surface of the IC chip;
- a crystal blank having electrodes at its outer periphery, said crystal blank disposed above the insulator plate at an interval;
- and
- a conductive adhesive securing the crystal blank to the insulator plate at each electrode of the crystal blank and connecting each conduction terminal on the inner wall surface.
- wherein both said crystal blank and said IC chip are accommodated in said recess.
Dependencies are inferred from the claim text.