Material for diamond sintered body die and diamond sintered body die
AssigneeSumitomo Electric Hardmetal Corp.
InventorsMinoru Yoshida, Takeru Nakashima, Tadashi Yamaguchi
Life of this patent
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Abstract
To provide a diamond compact die semi-manufactured product and a diamond compact die that do not crack during die processing. A diamond compact die semi-manufactured product includes a diamond compact and a holding ring. The holding ring is a cylinder composed of a tungsten alloy, and the inner diameter thereof is tapered. The diamond compact is tapered so as to fit to the taper of the cylinder and the diamond compact is press-fitted to the holding ring. For lower cost production, the tapered face of the diamond compact is formed by electric spark machining. The tungsten alloy contains 90% to 97% by weight of tungsten and 3% to 10% by weight of nickel.
Claims18
A diamond compact die semi-manufactured product comprising:
- a diamond compact and a holding ring, the holding ring being a cylinder composed of a tungsten alloy or a stainless steel alloy, the inner diameter thereof being tapered, the diamond compact being tapered, so as to fit the taper of the cylinder, wherein
- the diamond compact is press-fitted into the holding ring without resorting to heating the holding ring, and
- the diamond compact and the holding ring do not undergo mutual metallurgical bonding.
A diamond compact die comprising:
- a diamond compact and a holding ring, the holding ring being a cylinder composed of a tungsten alloy, the inner diameter thereof being tapered, the diamond compact being tapered so as to fit to the taper of the cylinder, the diamond compact having a wire-drawing hole in its center, wherein
- the diamond compact is press-fit into the holding ring without resorting to heating the holding ring, and
- the diamond compact and the holding ring do not undergo mutual metallurgical bonding.
Dependencies are inferred from the claim text.