Process solutions containing surfactants
AssigneeAir Products and Chemicals, Inc.
InventorsPeng Zhang, Danielle Megan King Curzi, Eugene Joseph Karwacki, Jr., Leslie Cox Barber
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Abstract
Process solutions comprising one or more surfactants are used to reduce the number of defects in the manufacture of semiconductor devices. In certain preferred embodiments, the process solution of the present invention may reduce post-development defects such as pattern collapse when employed as a rinse solution either during or after the development of the patterned photoresist layer. Also disclosed is a method for reducing the number of pattern collapse defects on a plurality of photoresist coated substrates employing the process solution of the present invention.
Claims14
A method for reducing the number of pattern collapse defects during the manufacture of semiconductor devices, the method comprising:
- providing a substrate comprising a photoresist coating;
- exposing the substrate to a radiation source to form a pattern on the photoresist coating;
- applying a developer solution to the substrate to form a patterned photoresist coating;
- optionally rinsing the substrate with deionized water;
- and
- contacting the substrate with a process solution comprising at least one solvent and 10 ppm to about 10,000 ppm of at least one surfactant having the formula (IVb):
- wherein R1 and R4 are each independently a straight or a branched alkyl group having from 3 to 10 carbon atoms;
- and r is 2 or 3.
Dependencies are inferred from the claim text.