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US 7,127,362 B2Granted
Process tolerant methods and apparatus for obtaining data
OwnerRandall S. Mundtinventor
Life of this patent
Estimating the term…
Abstract
Data are collected for deriving response models and information required for developing and maintaining processes and process tools. Methods and apparatus for collecting the data include a process tolerant sensor apparatus capable of collecting data with less perturbation and fewer disruptions than is usually possible using standard methods.
Claims20
A process tolerant sensor apparatus comprising:
- a) a bottom substrate;
- b) a top substrate;
- c) a plurality of sensors disposed between the bottom substrate and the top substrate;
- d) a plurality of electrically conductive interconnects disposed between the bottom substrate and the top substrate;
- e) electrically active components connected to the conductive interconnects for at least one of data acquisition, data storage, and communications;
- and
- f) a bonding material substantially filling the volume between the bottom substrate and the top substrate,
- wherein the bonding material is configured as a layer having a thickness between 0.05 mm and 10 mm.
5 more elements
A process tolerant sensor apparatus comprising:
- a) a bottom substrate;
- b) a top substrate comprising an RF shielding material, the RF shielding material comprising at least one of
- an electrically conductive layer comprising at least one of silver, nickel, aluminum, and carbon, and
- a magnetically permeable film or layer comprising at least one of iron and cobalt;
- c) a plurality of sensors disposed between the bottom substrate and the top substrate;
- d) a plurality of electrically conductive interconnects disposed between the bottom substrate and the top substrate;
- e) electrically active components connected to the conductive interconnects for at least one of data acquisition, data storage, and communications;
- and
- f) a bonding material substantially filling the volume between the bottom substrate and the top substrate.
6 more elements
A process tolerant sensor apparatus comprising:
- a) a bottom substrate;
- b) a top substrate;
- c) a plurality of sensors disposed between the bottom substrate and the top substrate;
- d) a plurality of electrically conductive interconnects disposed between the bottom substrate and the top substrate;
- e) electrically active components connected to the conductive interconnects for at least one of data acquisition, data storage, and communications;
- and
- f) a bonding material substantially filling the volume between the bottom substrate and the top substrate;
- wherein the bottom substrate is selected from the group consisting of semiconductor wafer substrate, lithography mask substrate, printed circuit board substrate, and flat panel display substrate and the top substrate is selected from the group consisting of semiconductor wafer substrate, lithography mask substrate, printed circuit board substrate, and flat panel display substrate.
5 more elements
Dependencies are inferred from the claim text.