Device for providing dual monitoring of digital equipment

#The present invention relates generally to telecommunications equipment. More particularly, the present invention relates to systems for monitoring digital equipment.

#A digital cross-connect system (DSX) provides a location for interconnecting two digital transmission paths. The apparatus for a DSX is located in one or more frames, or bays, usually in a telephone service provider's central office. The DSX apparatus also provides jack access to the transmission paths.

#DSX jacks are well known and typically include a plurality of bores sized for receiving plugs. A plurality of switches are provided adjacent the bores for contacting the plugs. The jacks are electrically connected to digital transmission lines, and are also electrically connected to a plurality of termination members used to cross-connect the jacks. By inserting plugs within the bores of the jacks, signals transmitted through the jacks can be interrupted or monitored.

#FIG. 1 is a schematic diagram of a prior art DSX system;

#FIG. 2 is a front perspective view of a monitor unit that is an embodiment of the present invention;

#FIG. 3 is a front view of the monitor unit of FIG. 2;

#Reference will now be made in detail to exemplary aspects of the present invention that are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings to refer to the same or like parts.

#FIGS. 2–5 illustrate a monitor unit 30 that is an embodiment of the present invention. The monitor unit 30 includes a chassis 32 having a front side 31 (shown in FIG. 3) and a back side 33 (shown in FIG. 4). The monitor unit 30 also includes multiple rows of monitor jacks 34 that are accessible from the front side 31 of the chassis 32. First and second groups 35, 37 of front connectors 38 (e.g., wire termination posts) are positioned on opposite sides of the monitor jacks 34. The front connectors 38 allow the monitor unit 30 to be electrically coupled to other DSX jacks (such as jacks 501, 503 shown in FIG. 7) by semi-permanent connections. The monitor unit 30 also includes a plurality of rear connectors 40 (e.g., co-axial connectors) that are accessible from the back side 33 of the chassis 32. The rear connectors 40 allow the monitor unit 30 to be electrically coupled to equipment 43 (see FIG. 7) such as testing or performance monitoring equipment.

#In use of the monitoring unit 30, signals from a DSX circuit desired to be monitored (e.g., the circuit defined by jacks 501, 503 of FIG. 7) are input to the monitoring unit 30 through the front connectors 38. From the front connectors 38, the signals are carried through the chassis 32 to the rear connectors 40. From the rear connectors 40, the signals are carried to test/monitoring equipment such as the equipment 43 of FIG. 7. To perform dual monitoring of a signal, a tip-and-ring plug can be inserted into a corresponding one of the monitor jacks 34. By inserting the plug in the jack 34, a portion of the signal can be temporarily patched (e.g., by a patch cord) to additional test/monitoring equipment such as test equipment 45 shown in FIG. 7. Dual monitoring is particularly useful for performing different types of tests on a signal, or for test verification.